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TC1269
300mA CMOS LDO with Shutdown and VREF Bypass
Features
* * * * * * * * * Very Low Ground Current for Longer Battery Life Very Low Dropout Voltage 300mA Output Circuit High Output Voltage Accuracy Standard or Custom Output Voltages Power Saving Shutdown Mode Bypass Input for Ultra Quiet Operation Over Current and Over Temperature Protection Space-Saving MSOP Package
General Description
The TC1269 is a fixed output, high accuracy (typically 0.5%) CMOS upgrade for older (bipolar) low dropout regulators. Total supply current is typically 50A at full load (20 to 60 times lower than in bipolar regulators). TC1269 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load), and fast response to step changes in load. Supply current is reduced to 0.05A (typical) and VOUT falls to zero when the shutdown input is low. The TC1269 incorporates both over temperature and over current protection. The TC1269 is stable with an output capacitor of only 1F and has a maximum output current of 300mA.
Applications
* * * * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulator for SMPS Pagers Digital Cameras
Typical Application
VOUT 1 + C1 1F 2 VOUT VIN 8 VIN
NC
SHDN
7 Shutdown Control (from Power Control Logic) 6
TC1269
3 NC NC Bypass
Device Selection Table
Part Number TC1269-2.5VUA TC1269-2.8VUA TC1269-3.0VUA TC1269-3.3VUA TC1269-5.0VUA Output* Voltage (V) 2.5 2.8 3.0 3.3 5.0 Package Junction Temp. Range
4 GND
CBYPASS 470pF (Optional)
8-Pin MSOP -40C to +125C 8-Pin MSOP -40C to +125C 8-Pin MSOP -40C to +125C 8-Pin MSOP -40C to +125C 8-Pin MSOP -40C to +125C
*Other output voltages are available. Please contact Microchip Technology Inc. for details.
Package Type
8-Pin MSOP
VOUT NC NC GND
1 2 3 4 8
VIN SHDN NC Bypass
TC1269
7 6 5
2002 Microchip Technology Inc.
DS21380B-page 1
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TC1269
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V Output Voltage.................... (VSS - 0.3) to (VIN + 0.3V) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Power Dissipation................Internally Limited (Note 6) Operating Temperature ............... -40C < TJ < +125C Storage Temperature.......................... -65C to +150C
TC1269 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1A, CL = 3.3F, SHDN > VIH, TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol VIN IOUTMAX VOUT V OUT/T VOUT/VIN VIN -VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Dropout Voltage Min -- 300 Typ -- -- Max 6.0 -- Units V mA V Note 1 Test Conditions
-- -- VR 0.5% VR - 2.5% -- VR + 2.5% -- -- -- -- -- -- -- -- -- -- -- -- 45 -- 40 0.05 0.5 20 80 240 50 0.05 50 550 0.04 260 -- -- -- 0.35 2.0 30 160 480 90 0.5 -- 650 -- -- -- 15
ppm/C Note 2 % % mV (VR + 1V) VIN 6V IL = 0.1mA to IOUTMAX IL = 0.1mA IL = 100mA IL = 300mA (Note 4) SHDN = VIH SHDN = 0V FRE 120Hz VOUT = 0V Note 5
VOUT/VOUT Load Regulation
ISS1 ISS2 PSRR IOUTSC V OUT/PD eN SHDN Input VIH VIL
Note 1: 2: 3:
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise SHDN Input High Threshold SHDN Input Low Threshold
VR is the regulator output voltage setting. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T
A A dB mA V/W
nV/Hz F = 1kHz, C OUT = 1F, R LOAD = 50 %VIN %VIN
4: 5: 6:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
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DS21380B-page 2
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TC1269
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin SOIC) 1 2 3 4 5 6 7
PIN FUNCTION TABLE
Symbol VOUT NC NC GND Bypass NC SHDN Regulated voltage output. No connect. No connect. Ground terminal. Reference bypass input. Connecting a 470pF to this input further reduces output noise. No connect. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05A (typical). Unregulated supply input. Description
8
VIN
2002 Microchip Technology Inc.
DS21380B-page 3
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TC1269
3.0 DETAILED DESCRIPTION
3.1 Bypass Input
The TC1269 is a precision regulator available in fixed voltages. Unlike the bipolar regulators, the TC1269 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery backup applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05A (typical), VOUT falls to zero. A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied.
3.2
Output Capacitor
FIGURE 3-1:
1 + C1 1F 2
TYPICAL APPLICATION CIRCUIT
VOUT VIN 8 + 7 C1 1F Battery + -
VOUT
NC
SHDN
TC1269
3 NC NC Bypass 6
Shutdown Control (from Power Control Logic)
A 1F (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0, and a resonant frequency above 1MHz. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
4 GND
CBYPASS 470pF (Optional)
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DS21380B-page 4
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TC1269
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX ILOAD TAMAX = 3.0V 10% = 250mA = 55C VOUTMIN = 2.7V - 2.5%
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150C. The regulator remains off until the die temperature drops to approximately 140C.
4.2
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation:
Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX - VOUTMIN) ILOADMAX = [(3.0 x 1.1) - (2.7 x .975)]250 x 10-3 = 167mW Maximum allowable power dissipation: PDMAX = (TJMAX - TAMAX) JA = (125 - 55) 200 = 350mW In this example, the TC1269 dissipates a maximum of 167mW; below the allowable limit of 350mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits.
EQUATION 4-1:
PD (VINMAX - VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current
The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA).
EQUATION 4-2:
PDMAX = (TJMAX - TAMAX) JA Where all terms are previously defined.
4.3
Layout Considerations
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit.
2002 Microchip Technology Inc.
DS21380B-page 5
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TC1269
5.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Line Regulation
0.012 0.010 10.0
Output Noise
2.00 RLOAD = 50 COUT = 1F 1.80
Load Regulation
LOAD REGULATION (%)
LINE REGULATION (%)
1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 1 to 100mA 1 to 50mA 1 to 300mA
NOISE (V/HZ)
0.008 0.006 0.004 0.002 0.000 -0.002 -0.004 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C)
1.0
0.1
0.0 0.01
0.01
1
10
100
1000
0.00 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C)
FREQUENCY (kHz)
Supply Current
100.0
DROPOUT VOLTAGE (V) SUPPLY CURRENT (A)
Dropout Voltage vs. Load Current
0.40 0.35 0.30 0.25 0.20 0C C 0.15 0.10 0.05 0.00 0 50 100 150 200 250 300 LOAD CURRENT (mA) -40C 125C 85C C 70C 25C
VOUT (V)
VOUT vs. Temperature
3.075 VIN = 4V ILOAD = 100A CLOAD = 3.3F
90.0 80.0 70.0 60.0 50.0 40.0 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C)
3.025
2.975
2.925 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (C)
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TC1269
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P Standard Reel Component Orientation for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
6.3
Package Dimensions
8-Pin MSOP
PIN 1
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.026 (0.65) TYP.
.122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
6 MAX. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21380B-page 7
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TC1269
NOTES:
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DS21380B-page 8
2002 Microchip Technology Inc.
TC1269
SALES AND SUPPORT
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21380B-page 9
TC1269
NOTES:
DS21380B-page 10
2002 Microchip Technology Inc.
TC1269
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21380B-page 11
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05/01/02
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*08312SD*

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